1 data sheet acquired from harris semiconductor schs240a features ? buffered inputs ? typical propagation delay - 6ns at v cc = 5v, t a = 25 o c, c l = 50pf ? exceeds 2kv esd protection mil-std-883, method 3015 ? scr-latchup-resistant cmos process and circuit design ? speed of bipolar fast?/as/s with signi?cantly reduced power consumption ? balanced propagation delays ? ac types feature 1.5v to 5.5v operation and balanced noise immunity at 30% of the supply ? 24ma output drive current - fanout to 15 fast? ics - drives 50 w transmission lines description the ac164 and act164 are 8-bit serial-in/parallel-out shift registers with asynchronous reset that utilize advanced cmos logic technology. data is shifted on the positive edge of the clock (cp). a low on the master reset ( mr) pin resets the shift register and all outputs go to the low state regardless of the input conditions. two serial data inputs (ds1 and ds2) are provided; either one can be used as a data enable control. pinout cd54ac164, cd54act164 (cerdip) CD74AC164, cd74act164 (pdip, soic) top view ordering information part number temp. range ( o c) package cd54ac164f3a -55 to 125 14 ld cerdip CD74AC164e -55 to 125 14 ld pdip CD74AC164m -55 to 125 14 ld soic cd54act164f3a -55 to 125 14 ld cerdip cd74act164e -55 to 125 14 ld pdip cd74act164m -55 to 125 14 ld soic notes: 1. when ordering, use the entire part number. add the suffix 96 to obtain the variant in the tape and reel. 2. wafer and die for this part number is available which meets all elec- trical specifications. please contact your local ti sales office or cus- tomer service for ordering information. ds1 ds2 q0 q1 q2 q3 gnd v cc q7 q6 q5 q4 mr cp 1 2 3 4 5 6 7 14 13 12 11 10 9 8 september 1998 - revised may 2000 caution: these devices are sensitive to electrostatic discharge. users should follow proper ic handling procedures. fast? is a trademark of fairchild semiconductor. copyright ? 2000, texas instruments incorporated cd54/74ac164, cd54/74act164 8-bit serial-in/parallel-out shift register [ /title (cd74 ac164 , cd74 act16 4) / sub- j ect (8- bit serial- in/par- allel- out shift regis- ter) / autho r () / key- words (har- ris semi- con- ductor, advan ced cmos , harris semi- con- ductor, advan ced ttl) / cre- ator ()
2 functional diagram mode select - truth table operating mode inputs outputs mr cp ds1 ds2 q0 q1 - q7 reset (clear) l x x x l l - l shift h - l l l q0 - q6 h - l h l q0 - q6 h - h l l q0 - q6 h - h h h q0 - q6 h = high voltage level steady state. l = low voltage level steady state. h = high voltage level one setup time prior to the low-to_high clock transition. l = low voltage level one setup time prior to the low-to-high clock transition. x = dont care. q = lowercase letters indicate the state of the referenced output prior to the low-to-high clock transition. - = low-to-high clock transition. 3 4 5 6 11 13 12 10 1 ds1 q0 q1 q2 q3 q4 q5 q6 q7 cp mr 98 2 ds2 gnd = 7 v cc = 14 cd54/74ac164, cd54/74act164
3 i absolute maximum ratings thermal information dc supply voltage, v cc . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to 6v dc input diode current, i ik for v i < -0.5v or v i > v cc + 0.5v . . . . . . . . . . . . . . . . . . . . . . 20ma dc output diode current, i ok for v o < -0.5v or v o > v cc + 0.5v . . . . . . . . . . . . . . . . . . . . 50ma dc output source or sink current per output pin, i o for v o > -0.5v or v o < v cc + 0.5v . . . . . . . . . . . . . . . . . . . . 50ma dc v cc or ground current, i cc or i gnd (note 3) . . . . . . . . . 100ma operating conditions temperature range, t a . . . . . . . . . . . . . . . . . . . . . . -55 o c to 125 o c supply voltage range, v cc (note 4) ac types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5v to 5.5v act types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5v to 5.5v dc input or output voltage, v i , v o . . . . . . . . . . . . . . . . . 0v to v cc input rise and fall slew rate, dt/dv ac types, 1.5v to 3v . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (max) ac types, 3.6v to 5.5v . . . . . . . . . . . . . . . . . . . . . . . . 20ns (max) act types, 4.5v to 5.5v. . . . . . . . . . . . . . . . . . . . . . . 10ns (max) thermal resistance (typical, note 5) q ja ( o c/w) pdip package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 soic package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 maximum junction temperature (plastic package) . . . . . . . . . . 150 o c maximum storage temperature range . . . . . . . . . .-65 o c to 150 o c maximum lead temperature (soldering 10s) . . . . . . . . . . . . . 300 o c (soic - lead tips only) caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operatio n of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not im plied. notes: 3. for up to 4 outputs per device, add 25ma for each additional output. 4. unless otherwise specified, all voltages are referenced to ground. 5. q ja is measured with the component mounted on an evaluation pc board in free air. dc electrical speci?cations parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units v i (v) i o (ma) min max min max min max ac types high level input voltage v ih - - 1.5 1.2 - 1.2 - 1.2 - v 3 2.1 - 2.1 - 2.1 - v 5.5 3.85 - 3.85 - 3.85 - v low level input voltage v il - - 1.5 - 0.3 - 0.3 - 0.3 v 3 - 0.9 - 0.9 - 0.9 v 5.5 - 1.65 - 1.65 - 1.65 v high level output voltage v oh v ih or v il -0.05 1.5 1.4 - 1.4 - 1.4 - v -0.05 3 2.9 - 2.9 - 2.9 - v -0.05 4.5 4.4 - 4.4 - 4.4 - v -4 3 2.58 - 2.48 - 2.4 - v -24 4.5 3.94 - 3.8 - 3.7 - v -75 (note 6, 7) 5.5 - - 3.85 - - - v -50 (note 6, 7) 5.5---- 3.85 - v cd54/74ac164, cd54/74act164
4 low level output voltage v ol v ih or v il 0.05 1.5 - 0.1 - 0.1 - 0.1 v 0.05 3 - 0.1 - 0.1 - 0.1 v 0.05 4.5 - 0.1 - 0.1 - 0.1 v 12 3 - 0.36 - 0.44 - 0.5 v 24 4.5 - 0.36 - 0.44 - 0.5 v 75 (note 6, 7) 5.5 - - - 1.65 - - v 50 (note 6, 7) 5.5----- 1.65 v input leakage current i i v cc or gnd - 5.5 - 0.1 - 1- 1 m a quiescent supply current msi i cc v cc or gnd 0 5.5 - 8 - 80 - 160 m a act types high level input voltage v ih - - 4.5 to 5.5 2-2-2- v low level input voltage v il - - 4.5 to 5.5 - 0.8 - 0.8 - 0.8 v high level output voltage v oh v ih or v il -0.05 4.5 4.4 - 4.4 - 4.4 - v -24 4.5 3.94 - 3.8 - 3.7 - v -75 (note 6, 7) 5.5 - - 3.85 - - - v -50 (note 6, 7) 5.5---- 3.85 - v low level output voltage v ol v ih or v il 0.05 4.5 - 0.1 - 0.1 - 0.1 v 24 4.5 - 0.36 - 0.44 - 0.5 v 75 (note 6, 7) 5.5 - - - 1.65 - - v 50 (note 6, 7) 5.5----- 1.65 v input leakage current i i v cc or gnd - 5.5 - 0.1 - 1- 1 m a quiescent supply current msi i cc v cc or gnd 0 5.5 - 8 - 80 - 160 m a additional supply current per input pin ttl inputs high 1 unit load d i cc v cc -2.1 - 4.5 to 5.5 - 2.4 - 2.8 - 3 ma notes: 6. test one output at a time for a 1-second maximum duration. measurement is made by forcing current and measuring voltage to minimize power dissipation. 7. test verifies a minimum 50 w transmission-line-drive capability at 85 o c, 75 w at 125 o c. act input load table input unit load ds1, ds2 0.5 mr 0.74 cp 0.71 note: unit load is d i cc limit specified in dc electrical specifications table, e.g., 2.4ma max at 25 o c. dc electrical speci?cations (continued) parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units v i (v) i o (ma) min max min max min max cd54/74ac164, cd54/74act164
5 prerequisite for switching function parameter symbol v cc (v) -40 o c to 85 o c -55 o c to 125 o c units min max min max ac types max. clock frequency f max 1.5 7 - 6 - mhz 3.3 (note 9) 62 - 54 - mhz 5 (note 10) 86 - 75 - mhz mr pulse width t w 1.5 49 - 56 - ns 3.3 5.5 - 6.3 - ns 5 3.9 - 4.5 - ns cp pulse width t w 1.5 73 - 84 - ns 3.3 8.2 - 9.4 - ns 5 5.9 - 6.7 - ns set-up time t su 1.5 27 - 31 - ns 3.3 3.1 - 3.5 - ns 5 2.2 - 2.5 - ns hold time t h 1.5 27 - 31 - ns 3.3 3.1 - 3.5 - ns 5 2.2 - 2.5 - ns mr to cp removal time t rem 1.5 1 - 1 - ns 3.3 1 - 1 - ns 51-1-ns act types max. clock frequency f max 5 (note 10) 80 - 70 - mhz mr pulse width t w 5 3.9 - 4.5 - ns cp pulse width t w 5 6.2 - 7.1 - ns set-up time t su 5 2.2 - 2.5 - ns hold time t h 5 2.6 - 3 - ns mr to cp removal time t rem 50-0-ns switching speci?cations input t r , t f = 3ns, c l = 50pf (worst case) parameter symbol v cc (v) -40 o c to 85 o c -55 o c to 125 o c units min typ max min typ max ac types propagation delay, cp to qn t plh , t phl 1.5 - - 143 - - 157 ns 3.3 (note 9) 4.5 - 15.9 4.4 - 17.5 ns 5 (note 10) 3.2 - 11.4 3.1 - 12.5 ns cd54/74ac164, cd54/74act164
6 propagation delay, mr to qn t plh , t phl 1.5 - - 158 - - 174 ns 3.3 5 - 17.7 4.9 - 19.5 ns 5 3.6 - 12.6 3.5 - 13.9 ns input capacitance c i - - -10- -10pf power dissipation capacitance c pd (note 11) - - 150 - - 150 - pf act types propagation delay, cp to qn t plh , t phl 5 (note 10) 3.8 - 13.5 3.7 - 14.9 ns propagation delay, mr to qn t plh , t phl 5 4.1 - 14.4 4 - 15.8 ns input capacitance c i - - -10- -10pf power dissipation capacitance c pd (note 11) - - 150 - - 150 - pf notes: 8. limits tested at 100%. 9. 3.3v min at 3.6v, max at 3v. 10. 5v min at 5.5v, max at 4.5v. 11. c pd is used to determine the dynamic power consumption per device. p d =c pd v cc 2 f i s (c l v cc 2 f o )+v cc d i cc , where f i = input frequency, f o = output frequency, c l = output load capacitance, v cc = supply voltage. switching speci?cations input t r , t f = 3ns, c l = 50pf (worst case) (continued) parameter symbol v cc (v) -40 o c to 85 o c -55 o c to 125 o c units min typ max min typ max figure 1. figure 2. figure 3. figure 4. cp any output t r t f t w v s 90% 10% input gnd 1/f max t plh t phl t tlh t thl v s 90% 10% mr v s t w t rec t phl any input cp input level gnd gnd input level v s v s ds2 (1) ds1 (2) cp valid v s t su t h t rec input level gnd gnd gnd input level input level v s t su t h v s input level gnd ds2 (1) cp v s t su t h v s gnd input level cd54/74ac164, cd54/74act164
7 dut output r l (note) output load 500 w c l 50pf note: for ac series only: when v cc = 1.5v, r l = 1k w. figure 5. propagation delay times ac act input level v cc 3v input switching voltage, v s 0.5 v cc 1.5v output switching voltage, v s 0.5 v cc 0.5 v cc cd54/74ac164, cd54/74act164
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) cd54ac164f3a active cdip j 14 1 tbd a42 snpb n / a for pkg type cd54act164f3a active cdip j 14 1 tbd a42 snpb n / a for pkg type CD74AC164e active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type CD74AC164ee4 active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type CD74AC164m active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim CD74AC164m96 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim CD74AC164m96e4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim CD74AC164me4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act164e active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type cd74act164ee4 active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type cd74act164m active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act164m96 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act164m96e4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act164m96g4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act164me4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act164mg4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. package option addendum www.ti.com 18-jul-2006 addendum-page 1
important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 18-jul-2006 addendum-page 2
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security low power wireless www.ti.com/lpw telephony www.ti.com/telephony video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments post office box 655303 dallas, texas 75265 copyright ? 2006, texas instruments incorporated
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